Manufacturing method of package device

ABSTRACT

The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of Chinese Patent Application Serial No. 202011353826.8, filed Nov. 26, 2020, the entire content of which is incorporated herein by reference.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The present disclosure relates to a manufacturing method of a package device, and more particularly to a manufacturing method of performing an inspection during the manufacturing process of package devices.

2. Description of the Prior Art

In package technologies, a redistribution layer may be fabricated on a large-sized substrate, and packaging process and cutting process are performed to fabricate a large number of package devices at the same time. However, in the current package technologies, there is no monitoring manner that can inspect and judge the process of the redistribution layer or the quality of the devices in real time. Usually, after the chips are bonded on the redistribution layer, the circuits of the redistribution layer are inspected whether it has a short circuit or an open circuit. In this way, when defects were found in the circuit inspection of the redistribution layer, the chips that have been bonded on the redistribution layer cannot be reused, thus resulting in waste of manufacturing cost.

SUMMARY OF THE DISCLOSURE

An embodiment of the present disclosure provides a manufacturing method of a packaged device. First, a carrier substrate, at least one first conductive layer, and a release layer are provided, where the carrier substrate has at least one device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. Then, a second conductive layer is formed on the release layer, where at least one of the first conductive layer and the second conductive layer includes at least one first pad that is disposed in the peripheral region of the carrier substrate, and the second conductive layer has at least one second pad that is disposed in the device region of the carrier substrate and is electrically connected to the first pad through the first conductive layer. Thereafter, an inspection step is performed to provide an input signal to one of the first pad and the second pad, and receive an output signal from another of the first pad and the second pad.

These and other objectives of the present disclosure will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the embodiment that is illustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure.

FIG. 2 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure.

FIG. 3 is a schematic top view of a package device before a cutting process is performed according to some embodiments of the present disclosure.

FIG. 4 is an enlarged schematic diagram of inspection lines and pads corresponding to a single device region of FIG. 3.

FIG. 5 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure.

FIG. 6 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure.

FIG. 7 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure.

FIG. 8 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure.

FIG. 9 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure.

DETAILED DESCRIPTION

The contents of the present disclosure will be described in detail with reference to specific embodiments and drawings. It is noted that, for purposes of illustrative clarity and being easily understood by the readers, the following drawings may be simplified schematic diagrams, and components therein may not be drawn to scale. The numbers and dimensions of the components in the drawings are just illustrative, and are not intended to limit the scope of the present disclosure.

Certain terms are used throughout the specification and the appended claims of the present disclosure to refer to specific components. Those skilled in the art should understand that electronic equipment manufacturers may refer to a component by different names, and this document does not intend to distinguish between components that differ in name but not function. In the following description and claims, the terms “comprise”, “include” and “have” are open-ended fashion, so they should be interpreted as “including but not limited to . . . ”.

Furthermore, the terms “coupled to” and “electrically connected to” here include any directly and indirectly connecting means. Therefore, if it is described in this document that a first component is coupled or electrically connected to a second component, it means that the first component may be directly connected to the second component, or may be indirectly connected to the second component through other components or other connecting means.

In some embodiments of the present disclosure, terms regarding bonding and connection, such as“connection”, “interconnection”, etc., unless specifically defined, may mean that two structures are in direct contact, or it may also mean that two structures are not in direct contact, where other structures are disposed between these two structures. The terms regarding bonding and connection may also include the cases where both structures are movable or both structures are fixed.

It should be understood that the components or devices in the drawings may be disposed in various forms which are known to those skilled in the art. In addition, spatially relative terms, such as “below”, “lower”, “bottom”, “upper”, “higher”, or “top”, may be used in the embodiments to describe one component's relationship to another component as illustrated in the drawings. It is understandable that if the device in the drawings is turned over to make it upside down, the components described on the “lower” side would then become components on the “higher” side. The embodiments of the present disclosure can be understood with reference to the drawings, and the drawings of the present disclosure are also regarded as a part of the disclosed description. It should be understood that the drawings of the present disclosure may not be drawn to scale. In fact, the dimensions of the components may be arbitrarily increased or reduced for clarity of the features of the present disclosure. Furthermore, when it is mentioned that a first material layer is disposed on or above a second material layer, it includes the cases where the first material layer is in direct contact with the second material layer, or there may be one or more other material layers disposed between the first material layer and the second material layer. In this case, the first material layer may not be in direct contact with the second material layer.

In addition, it should be understood that although the terms “first”, “second”, “third”, etc. may be used herein to describe various elements, components, or portions, these elements, components or portions should not be limited by these terms. These terms may be only used to distinguish different elements, components, regions, layers or portions. Thus, a first element, component, region, layer or portion discussed below could be termed a second element, component, region, layer or portion without departing from the present disclosure.

It should be understood that according to the following embodiments, features of different embodiments may be replaced, recombined or mixed to constitute other embodiments without departing from the spirit of the present disclosure.

FIG. 1 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure, and showing the structure of a package device 28 in a cross-sectional view. The manufacturing method of the package device 28 according to one embodiment of the present disclosure includes the following steps. The manufacturing method of the present disclosure may use, for example, a fan-out panel level package (FOPLP) or fan-out wafer level package (FOWLP) technology. The followings are described with FOPLP technology as an example, but not limited thereto. Moreover, the manufacturing methods of the present disclosure are not limited to the following steps, and any other step may be performed before, after, or between the steps illustrated herein. As shown in FIG. 1, the manufacturing method of the package device 28 of the present disclosure may include providing a carrier substrate 12, at least one first conductive layer 14 and a release layer 16. In this embodiment, first, the carrier substrate 12 may be provided, and then at least one first conductive layer 14 and the release layer 16 are formed on the carrier substrate 12. The carrier substrate 12 may be used to carry the components formed thereon during the process of manufacturing the package device 28. The carrier substrate 12 may be, for example, a rigid substrate or a flexible substrate disposed on a rigid carrier. The carrier substrate 12 may include, for example, glass, polyimide (PI), polyethylene terephthalate (PET) or other suitable materials. In the embodiment of FIG. 1, the carrier substrate 12 may have at least one device region 12 a and a peripheral region 12 b, where the device region 12 a may be used as a region for forming the package device 28, and the peripheral region 12 b may be used as a region for disposing the pads for inspecting the package device or other components that are not in the package device 28. The peripheral region 12 b may be disposed on at least one side of the device region 12 a. For example, as shown in FIG. 3, the peripheral region 12 b may surround the device region 12 a, but not limited thereto.

In the embodiment of FIG. 1, the first conductive layer 14 may be formed on the carrier substrate 12 before the release layer 16 is formed, and thus the first conductive layer 14 may be disposed between the release layer 16 and the carrier substrate 12. The first conductive layer 14 may include at least one inspection line 14 a, where the inspection line 14 a may extend from the device region 12 a to the peripheral region 12 b, so that the devices formed in the device region 12 a may be inspected through the inspection line 14 a in the subsequent manufacturing processes. In the embodiment of FIG. 1, the number of inspection lines may be multiple, but not limited thereto. In some embodiments, the material of the first conductive layer 14 may include silver, copper, aluminum, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium, indium, bismuth, alloys thereof, combinations thereof, or other metal materials with good conductivity, but not limited thereto. In some embodiments, the first conductive layer 14 may be, for example, an integrated passive device layer or a seed layer. For example, the first conductive layer 14 may also include passive components, such as capacitors, inductors, resistors, other suitable components, or a combination of at least two of the above, but not limited thereto. The inspection line 14 a may be, for example, mesh-shaped, linear, or other suitable shapes, but not limited thereto.

As shown in FIG. 1, then, the release layer 16 may be disposed on the first conductive layer 14 and the carrier substrate 12, where the release layer 16 may extend from the device region 12 a to the peripheral region 12 b. For example, the release layer 16 may include a photo-release material or a thermal-release material, but not limited thereto. The material of the release layer 16 may include parylene, organic silicone resin or silicone oil, but not limited thereto. After the release layer 16 is provided, a plurality of through holes 16 v may be formed in the release layer 16, and a contact structure may be formed in each of the through holes 16 v, thereby forming a plurality of contact structures penetrating the release layer 16. The contact structures may be electrically connected to the corresponding inspection lines 14 a. For example, the contact structures may include a contact structure 18 a in the device region 12 a and a contact structure 18 b in the peripheral region 12 b. The contact structure 18 a and the corresponding contact structure 18 b may be connected to two ends of the same inspection line 14 a respectively, so that the circuits in the device region 12 a may be electrically connected to the contact structure 18 b in the peripheral region 12 b through the inspection line 14 a. The contact structure 18 a and the contact structure 18 b may include conductive materials, such as silver, copper, aluminum, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium, indium, bismuth, alloys thereof, combinations thereof, or other metal materials with good conductivity, but not limited thereto. Therefore, the contact structure 18 a and the contact structure 18 b may be used for electrical connection with the subsequently formed devices.

As shown in FIG. 1, after the contact structures are formed, a redistribution layer 20 may be formed on the release layer 16 and the contact structures. The redistribution layer 20 may be electrically connected to the first conductive layer 14 through the contact structure 18 a and the contact structure 18 b. The redistribution layer 20 may include a plurality of second conductive layers (such as a second conductive layer 221, a second conductive layer 222, and a second conductive layer 223) and multiple dielectric layers (such as a dielectric layer 241 and a dielectric layer 242). One of the dielectric layers between two adjacent second conductive layers may have a plurality of openings 24 h, so that the traces or the pads formed of the two adjacent second conductive layers may be electrically connected to each other through the openings 24 h. In one embodiment, the second conductive layers may include silver, copper, aluminum, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium, indium, bismuth, alloys thereof, combinations thereof or other metal materials with good conductivity, but not limited thereto. It should be noted that an inspection step may be performed during the process of forming the redistribution layer 20 to inspect the circuit formed of at least one layer of the second conductive layers.

The manufacturing method of the redistribution layer 20 with the inspection step will be described in detail below, but it is not limited thereto. Please still refer to FIG. 1, after the contact structures are formed, the second conductive layer 221 may be formed on the release layer 16. In the embodiment shown in FIG. 1, the second conductive layer 221 may be formed on the contact structures, and the second conductive layer 221 may include a plurality of conductive pillars (such as a conductive pillar 221 a and a conductive pillar 221 b), where the conductive pillars may be electrically connected to the corresponding contact structures respectively. For example, the conductive pillar 221 a in the device region 12 a may be electrically connected to the contact structure 18 a in the device region 12 a, and the conductive pillar 221 b in the peripheral region 12 b may be electrically connected to the contact structure 18 b in the peripheral region 12 b. Subsequently, the dielectric layer 241 is formed on the release layer 16 around the conductive pillar 221 a and the conductive pillar 221 b. In one embodiment, the upper surface portion of the dielectric layer 241 may be removed, for example, by polishing until the conductive pillar 221 a and the conductive pillar 221 b are exposed, but not limited thereto. In some embodiments, when the upper surface of the dielectric layer 241 is higher than the upper surface of the conductive pillar 221 a, the conductive pillar 221 a and the conductive pillar 221 b may still be exposed by forming openings in the dielectric layer 241.

As shown in FIG. 1, thereafter, the second conductive layer 222 is formed on the dielectric layer 241 that is formed on the release layer 16. The second conductive layer 222 may include, for example, at least one pad 222 a and at least one pad 222 b, where the pad 222 a may be disposed in the device region 12 a and electrically connected to the corresponding conductive pillar 221 a, and the pad 222 b may be disposed in the peripheral region 12 b and electrically connected to the corresponding conductive pillar 221 b. Then, the dielectric layer 242 is formed on the second conductive layer 222 and the dielectric layer 241, and the openings 24 h are formed in the dielectric layer 242 to expose the corresponding pad 222 a and the corresponding pad 222 b, respectively. In the embodiment of FIG. 1, the number of the pads 222 a and the number of the pads 222 b may be multiple, but not limited thereto. In some embodiments, the second conductive layer 222 may also include at least one trace (not shown) according to requirements, which is disposed in the device region 12 a and used to laterally and electrically connect the corresponding pad 222 a or pad 222 b to the pads formed in the subsequent steps. In one embodiment, the second conductive layer 221 and the second conductive layer 222 may be formed separately or together (formed of the same conductive layer), but not limited thereto. In one embodiment, the contact structures, and the second conductive layer 221 may be formed separately or together (formed of the same conductive layer), but not limited thereto. In one embodiment, the contact structures, the second conductive layer 221, and the second conductive layer 222 may be formed separately, or together (formed of the same conductive layer), but not limited thereto. It should be noted that the inspection step may be performed in real time in the process of forming the redistribution layer 20. For example, input/output terminals 26 may be used to perform inspection on the circuit formed of at least one layer of the second conductive layers through the pad 222 a and the pad 222 b.

Subsequently, the second conductive layer 223 is formed on the dielectric layer 242 to form the redistribution layer 20 of the package device 28. The second conductive layer 223 may include at least one pad 223 a and at least one pad 223 b, and the pad 223 a may be electrically connected to the pad 223 b through the first conductive layer 14. The pad 223 a may be electrically connected to the first conductive layer 14 through the contact structure 221 a, and the pad 223 b may be electrically connected to the first conductive layer 14 through the contact structure 221 b. In the embodiment of FIG. 1, the number of the pads 223 a and the number of the pads 223 b may be multiple, but not limited thereto. As shown in FIG. 1, after the second conductive layer 223 is formed, an inspection step may be performed to inspect whether the circuits formed of the second conductive layer 221, the second conductive layer 222, and the second conductive layer 223 have short-circuit or open-circuit problems. In the inspection step shown in FIG. 1, the pad 223 b may be used as an inspection pad, one of the input/output terminals 26 may be used to provide an input signal to one of the pad 223 b and the exposed pad 223 a, and another of the input/output terminals 26 may be used to receive an output signal from another of the pad 223 b and the pad 223 a. Through the received output signal, it may be determined whether the line connected between the pad 223 b and the pad 223 a is conductive. The input/output terminal 26 may input signals or receive signals through a contact-type or noncontact-type manner. For a contact-type manner, the input/output terminals 26 may include a contact-type detector, such as a probe, and the input/output terminals 26 may be in direct contact with the pad 223 b and the pad 223 a, respectively, but not limited thereto. For a noncontact-type manner, the input/output terminals 26 may receive signals in a noncontact-type manner, for example, through being separated from the pad 223 a by a certain distance to receive the electric field signal generated from the pad 223 a. In this case, the input/output terminals 26 for receiving the output signal may include, for example, an electric field sensor, but not limited thereto. In some embodiments, after the inspection step is performed on the second conductive layer 223, a cutting process may be optionally performed to separate the redistribution layer 20 in the device region 12 a and the peripheral region 12 b, and a release process may be performed to separate the redistribution layer 20 from the release layer 16. Therefore, the redistribution layer 20 in the peripheral region 12 b may be removed, and the release layer 16 and the carrier substrate 12 and the first conductive layer 14 under it may also be removed. As a result, the redistribution layer 20 in the device region 12 a may form the package device 28, but not limited thereto.

In some embodiments, another inspection step may be performed between the steps of forming the second conductive layer 221 and forming the dielectric layer 241 or between the steps of forming the dielectric layer 241 and forming the second conductive layer 222, so as to inspect the quality of the formed second conductive layer 221. In some embodiments, another inspection step may be performed between the steps of forming the second conductive layer 222 and forming the dielectric layer 242, or between the steps of forming the dielectric layer 242 and forming the second conductive layer 223, so as to inspect the quality of the formed second conductive layer 222. When the inspection step is performed between the steps of forming the dielectric layer 242 and forming the second conductive layer 223, the input/output terminals 26 may provide input signals to or receive output signals from the corresponding pad 222 a and/or the pad 222 b through the openings 24 h in the dielectric layer 242.

FIG. 2 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure. As shown in FIG. 2, after the inspection step of the second conductive layer 223 shown in FIG. 1, at least one dielectric layer 243 may be optionally formed on the second conductive layer 223 and the dielectric layer 242, and openings 24 h are formed in the dielectric layer 243 to expose the corresponding pad 223 a and the corresponding pad 223 b. Next, at least one second conductive layer 224 is formed on the dielectric layer 243 to form the redistribution layer 20. The second conductive layer 224 may include at least one pad 224 a in the device region 12 a and at least one pad 224 b in the peripheral region 12 b. In the embodiment of FIG. 2, the number of the pads 224 a and the number of the pads 224 b may be multiple, but not limited thereto. In some embodiments, after the second conductive layer 224 is formed, at least another inspection step may be performed to provide an input signal to one of the pad 224 b and the exposed pad 224 a, and to receive an output signal from another of the pad 224 b and the pad 224 a to inspect the quality of the formed second conductive layer 224, thereby checking whether the alignment relationship between the second conductive layer 224 and the underlying second conductive layer 223 meets the standard, and confirming whether the circuit between the pad 224 a and the pad 224 b has a short-circuit or open-circuit problem.

In some embodiments, as shown in FIG. 2, after the inspection step of the second conductive layer 224, a cutting process may be performed to separate the redistribution layer 20 in the device region 12 a and the peripheral region 12 b. In addition, a release process is performed to separate the redistribution layer 20 from the release layer 16. Therefore, the redistribution layer 20 in the peripheral region 12 b is removed, and the release layer 16 and the carrier substrate 12 and the first conductive layer 14 under it are also removed. As a result, the redistribution layer 20 in the device region 12 a may form the package device 28. In some embodiments, the order of the cutting process and the release process may be interchanged with each other. In some embodiments, since a portion of the contact structure 18 a will remain on the lower surface of the conductive pillar 221 a in the release process, the finally formed package device 28 may have a downwardly protruding structure on the lower surface of the conductive pillar 221 a, but not limited thereto. In some embodiments, the manufacturing method of the package device may further include disposing electronic components, such as chips, on the redistribution layer 20, and forming an encapsulation gel around the electronic components before the cutting process and the release process, so that the formed package device may include the electronic components, but not limited thereto.

The inspection steps of the present disclosure will be further described in the followings. FIG. 3 is a schematic top view of a package device before a cutting process is performed according to one embodiment of the present disclosure. FIG. 4 is an enlarged schematic diagram of the inspection lines and the pads corresponding to a single device region of FIG. 3. For clarity, the components in the device region 12 a are omitted in FIG. 3, and not limited thereto. As shown in FIG. 3, the carrier substrate 12 may have a plurality of device regions 12 a, and the inspection lines 14 a may extend from different device regions 12 a to the peripheral region 12 b for electrically connecting different pads in the different device regions 12 a to the corresponding pads in the peripheral region 12 b, thereby the circuits in the different device regions 12 a may be inspected through the exposed pads. The pads 223 b shown in FIG. 3 are taken as the pads 223 b of the uppermost second conductive layer located in the peripheral region 12 b shown in FIG. 1, for example, but not limited thereto. In some embodiments, the pads 223 b in the peripheral region 12 b shown in FIG. 3 may also be the pads of any layer of the second conductive layers or the pads of the first conductive layer, but not limited thereto.

In the embodiment of FIG. 3, the pads 223 b in the peripheral region 12 b for inspecting the circuits in the same device region 12 a may be divided into a plurality of inspection groups, so that different circuits in the same device region 12 a may be inspected at the same time or in batches through different pads 223 b. In the embodiment of FIG. 3, the pads 223 b in the same device region 12 a are divided into, for example, a pad 223 b 1 of a first inspection group, a pad 223 b 2 of a second inspection group, a pad 223 b 3 of a third inspection group, and a pad 223 b 4 of a fourth inspection group, but not limited thereto. The number of the pads 223 b corresponding to at least one of the inspection groups of the same device region 12 a may not be limited to one shown in FIG. 3, and may also be adjusted to multiple according to requirements. In some embodiments, the number of the inspection groups divided from the pads 223 b in at least two different device regions 12 a may also be different from each other, but not limited thereto.

As shown in FIG. 3, for the same device region 12 a, according to the number of the inspection groups divided from the pads 223 b, the inspection lines 14 a may be divided into inspection lines corresponding to different inspection groups. For example, the inspection lines 14 a may be divided into a first inspection line 14 a 1 as being electrically connected to the pad 223 b 1 of the first inspection group, a second inspection line 14 a 2 as being electrically connected to the pad 223 b 2 of the second inspection group, a third inspection line 14 a 3 as being electrically connected to the pad 223 b 3 of the third inspection group, and a fourth inspection line 14 a 4 as being electrically connected to the pad 223 b 4 of the fourth inspection group. The numbers of the first inspection line 14 a 1, the second inspection line 14 a 2, the third inspection line 14 a 3, and the fourth inspection line 14 a 4 are not limited to those shown in FIG. 3, and may be adjusted according to requirements.

FIG. 4 further shows the connection relationship between the pads and the inspection lines 14 a in the single device region 12 a, but the positions and the structures of the pads and the inspection lines 14 a in the device region 12 a of the present disclosure are not limited to those shown in FIG. 4, and may be adjusted according to design requirements. The pads in the device region 12 a and the pads in the peripheral region 12 b shown in FIG. 4 are respectively, for example, the pads 223 a and the pads 223 b formed of the uppermost second conductive layer 223 shown in FIG. 1. The following inspection steps will be described with reference to FIG. 4, but not limited thereto. As shown in FIG. 1 and FIG. 4, the pads 223 a of the second conductive layer 223 in the device region 12 a may be divided into a plurality of pad groups which are electrically isolated from each other, and the pads 223 b in the peripheral region 12 b for inspection may be electrically connected to the corresponding pad groups respectively through the first conductive layer 14. In the embodiment of FIG. 4, the pads 223 a in the device region 12 a may be divided into a first pad group, a second pad group, a third pad group, and a fourth pad group that are electrically isolated from each other. The pads 223 a 1 of the first pad group may be electrically connected to the pad 223 b 1 of the first inspection group through the corresponding first inspection line 14 a 1, and the pads 223 a 2 of the second pad group may be electrically connected to the pad 223 b 2 of the second inspection group through the corresponding second inspection line 14 a 2, the pads 223 a 3 of the third pad group may be electrically connected to the pad 223 b 3 of the third inspection group through the corresponding third inspection line 14 a 3, and the pads 223 a 4 of the fourth pad group may be electrically connected to the pad 223 b 4 of the fourth inspection group through the corresponding fourth inspection line 14 a 4.

In the same pad group, the number of the pads 223 a electrically connected to the same pad 223 b in the peripheral region 12 b may be at least one, in other words, at least one inspection line 14 a may be electrically connected to at least one pad 223 a in the device region 12 a. For example, in the embodiment of FIG. 4, the number of the pads 223 a 1 electrically connected to the same pad 223 b 1 may be two, but not limited thereto. In some embodiments, the adjacent pads 223 a in the device region 12 a (for example, the pad 223 a 1 and the pad 223 a 2, or the pad 223 a 3 and the pad 223 a 4) may be electrically connected to different inspection lines 14 a (for example, the first inspection line 14 a 1 and the second inspection line 14 a 2) respectively. Therefore, the isolation between the adjacent pads 223 a in the device region 12 a may be inspected through different pads 223 b (for example, the pad 223 b 1 and the pad 223 b 2). In addition, in the embodiment of FIG. 4, the numbers of the pads 223 b 1 of the first inspection group, the pads 223 b 2 of the second inspection group, the pads 223 b 3 of the third inspection group, and the pads 223 b 4 of the fourth inspection group may be respectively multiple, but not limited thereto. In this case, the pads 223 b of the same inspection group may be electrically connected to or electrically isolated from each other.

As shown in FIG. 4, forming the redistribution layer 20 may further includes forming a plurality of lines 30, and the pads 223 a in the device region 12 a may be electrically connected to the corresponding inspection lines 14 a through corresponding lines 30, respectively. The line 30 may be defined as a line electrically connected between one of the pads in the device area 12 a and the corresponding inspection line 14 a, for example, the line 30 may include traces and other pads in the second conductive layer which have been formed before the inspection step is performed and are electrically connected between the corresponding pad 223 a and the corresponding inspection line 14 a. The line 30 may include, for example, one of the pads 222 a of the second conductive layer 222 and its corresponding trace, one of the conductive pillars 221 a of the second conductive layer 221, and the corresponding contact structure 18 a as shown in FIG. 1, but not limited thereto. In the embodiment of FIG. 4, two different lines 30 corresponding to different two pad groups may be electrically isolated from each other, but not limited thereto. In some embodiments, at least two lines 30 may also be electrically connected to each other according to inspection requirements or line design requirements.

As shown in FIG. 4, in the inspection step of one embodiment, two input/output terminals 26 may be used to provide the input signal to one of one of the pads 223 b 1 of the first inspection group and the corresponding pad 223 a 1 in the device region 12 a, and to receive the output signal from another of the pad 223 b 1 of the first inspection group and the corresponding pad 223 a 1 in the device region 12 a, thereby determining whether the line connected between the pad 223 b 1 of the first inspection group and the pad 223 a 1 is conductive. In some embodiments, when the input signal is provided to one of the pads 223 a and the pads 223 b, the inspection step may also include receiving an output signal and another output signal from at least two pads 223 a or at least two corresponding pads 223 b, respectively. Specifically, while receiving the output signal, the inspection step may optionally include using another input/output terminal 26 to receive the another output signal from the pad 223 a (for example, the pad 223 a 2) adjacent to the pad 223 a 1 and/or its line 30, or from the pad 223 b (for example, the pad 223 b 2) electrically connected thereto. For example, when the pad 223 a 2 or the corresponding line 30 is adjacent to the pad 223 a 1 or the line 30 corresponding to the pad 223 a 1, the another output signal may be received through the pad 223 a 2 or the pad 223 b 2. Since no input signal is provided to the pad 223 a 2 or the pad 223 b 2 at this time, through the another output signal, it may be determined whether the pad 223 a 1 and the pad 223 a 2 have a short circuit. In some embodiments, while receiving the output signal, the inspection step may also include, for example, using other input/output terminals 26 to receive other output signals from the pad 223 a 3 or the pad 223 b 3 and/or from the pad 223 a 4 or the pad 223 b 4. In some embodiments, since the first conductive layer (for example the first conductive layer 14 shown in FIG. 1) used to form the inspection lines 14 a may include passive components, in the inspection step, the received output signal may be used to determine whether it is normal based on the circuit formed of the lines 30 and the passive components.

After inspecting the line 30 between the pad 223 b 1 of the first inspection group and the pad 223 a 1 of the first pad group, the input/output terminals 26 may be used to sequentially inspect the line 30 between the pads 223 b 2 of the second inspection group and the pads 223 a 2 of the second pad group, the line 30 between the pads 223 b 3 of the third inspection group and the pads 223 a 3 of the third pad group, and the line 30 between the pads 223 b 4 of the fourth inspection group and the pads 223 a 4 of the fourth pad group in a similar manner. The inspection sequence for the line 30 between the pad 223 b 1 of the first inspection group and the pad 223 a 1 of the first pad group, the line 30 between the pad 223 b 2 of the second inspection group and the pad 223 a 2 of the second pad group, the line 30 between the pad 223 b 3 of the three inspection group and the pad 223 a 3 of the third pad group, and the line 30 between the pad 223 b 4 of the fourth inspection group and the pad 223 a 4 of the fourth pad group is not limited to their arrangement order, it may be adjusted according to the actual configuration relationships or the requirements. In some embodiments, the inspection step may also include simultaneously inspecting the lines 30 of different inspection groups. In some embodiments, the configurations of the lines 30 of different inspection groups may be the same or different, but not limited thereto.

In some embodiments, when there are multiple pads 223 b in the same inspection group, the lines 30 between at least two of the pads 223 b of the same inspection group and the corresponding pads 223 a in the device region 12 a may be inspected at the same time. For example, in one inspection step, a plurality of input/output terminals 26 may be used to provide at least two input signals to at least two pads 223 b 1 of the first inspection group, and to receive output signals from two of the corresponding pads 223 a 1 in the device region 12 a, but not limited thereto. In some embodiments, the input signals may include, for example, a low-frequency signal, a high-frequency signal, or a combination thereof, but not limited thereto. When inspecting at least two lines 30 that are isolated from each other, the input signals transmitted to the at least two lines 30 may be, for example, the low-frequency signal and the high-frequency signal, respectively. In some embodiments, the pads 223 a in the device region 12 a and the pads 223 b in the peripheral region 12 b shown in FIG. 4 may also apply to the pads formed of any conductive layer shown in FIG. 2.

It is noted that through the above-mentioned manufacturing methods of package devices, the inspection steps may be performed in real time on the second conductive layers formed indifferent steps, so that the components of the package devices may be inspected out the defects in real time during the manufacturing processes without waiting for the inspection after the chips are bonded thereon. Alternatively, the components of the package devices may be repaired before the package devices are completed, thereby reducing the manufacturing cost.

The manufacturing methods of the package devices are not limited to the above-mentioned embodiments, and different embodiments may be implemented. To simplify the description, different embodiments in the followings will use the same reference numerals as those in some embodiments to denote the same components. In order to clearly describe the different embodiments, the followings will describe the differences between the different embodiments, and the repeated portions will not be described again.

FIG. 5 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure. In the manufacturing method of this embodiment, in addition to the inspection lines 14 a, the first conductive layer 14 may further include at least one pad 14 b disposed in the peripheral region 12 b, and the pad 14 b may be electrically connected to the inspection line 14 a. Moreover, the release layer 16 and the redistribution layer 20 may not be formed on the pad 14 b, so that the pad 14 b is exposed. Therefore, the input/output terminal 26 may be used to provide input signals to or receive output signals from the pad 14 b during the inspection step. The other portions of the manufacturing method of this embodiment may be the same as or similar to the above-mentioned embodiments. Therefore, the same portions may refer to the description of the above-mentioned embodiments, and will not be repeated. In some embodiments, the redistribution layer 20 may not be formed in the peripheral region 12 b, so that the second conductive layer 221, the second conductive layer 222, the second conductive layer 223, and the second conductive layer 224 may have no pad in the peripheral region 12 b. In some embodiments, the pads of the first inspection group, the pads of the second inspection group, the pads of the third inspection group, and the pads of the fourth inspection group shown in FIG. 3 and FIG. 4 may respectively include the pad 14 b formed of the first conductive layer 14 of FIG. 5.

FIG. 6 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure. In the manufacturing method of this embodiment, when the second conductive layer (for example, the second conductive layer 224) includes pads (for example, the pads 224 b) in the peripheral region 12 b, the first conductive layer 14 may also include at least one pad 14 b disposed in the peripheral region 12 b, and the pad 14 b may be electrically connected to the inspection line 14 a. In this embodiment, the release layer 16 and the redistribution layer 20 may not be formed on the pad 14 b, so that the pad 14 b is exposed. Therefore, one of the input/output terminals 26 may be used to provide the input signal to or receive the output signal from the pad 14 b during the inspection step. The other portions of the manufacturing method of this embodiment may be the same as or similar to those of the above-mentioned embodiments, so the same portions may refer to the description of the above-mentioned embodiments, and will not be repeated. In some embodiments, the pads of the first inspection group, the pads of the second inspection group, the pads of the third inspection group, and the pads of the fourth inspection group shown in FIG. 3 and FIG. 4 may respectively include the pad 14 b formed of the first conductive layer 14 of FIG. 6.

FIG. 7 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure. As shown in FIG. 7, in the manufacturing method of this embodiment, before the release layer 16 is formed, at least two first conductive layers 14 and at least one insulating layer 32 may be provided, and the insulating layer 32 may be disposed between the at least two first conductive layers 14. In an example of forming two first conductive layers 14, after the carrier substrate 12 is provided, one of the first conductive layers 14 is firstly formed on the carrier substrate 12, and then the insulating layer 32 may be formed on the one of the first conductive layers 14 and the carrier substrate 12, and a plurality of through holes 32 v may be formed in the insulating layer 32. Thereafter, another of the first conductive layers 14 may be formed on the insulating layer 32. In this embodiment, each of the first conductive layers 14 may include inspection lines 14 a for electrically connecting the pads of the second conductive layers in the device region 12 a to the pads of the second conductive layers in the peripheral region 12 b. Taking the second conductive layer 224 as an example, the inspection line 14 a may electrically connect the pad 224 a of the second conductive layer 224 to the pad 224 b of the second conductive layer 224. In the embodiment of FIG. 7, the first conductive layer 14 formed on the insulating layer 32 may further include a connection pad 14 c that extends into the through holes 32 v of the insulating layer 32, thereby electrically connecting the inspection lines 14 a of the first conductive layer 14 between the insulating layer 32 and the carrier substrate 12 to the redistribution layer 20. It should be noted that the inspection lines 14 a of different first conductive layers 14 may be electrically isolated from each other, so that different pads of the second conductive layers in the device region 12 a (for example, the pads 224 a) may be electrically connected to different pads in the peripheral region 12 b (for example, the pads 224 b), respectively, through the inspection lines 14 a of different first conductive layers 14. Through the design of the multi-layered first conductive layer 14, the manners for electrically connecting the pads in the device region 12 a to the pads in the peripheral region 12 b may be increased, thereby increasing the number of pad groups and the number of pads for inspection in the peripheral region 12 b. In other words, compared with the embodiment of FIG. 2, the pads in the device region 12 a may be divided into more groups in the design of this embodiment, thereby increasing the manners of inspecting circuits, or simultaneously performing inspection on more pad groups to improve inspection efficiency. In some embodiments, the first conductive layer 14 shown in FIG. 5 or FIG. 6 may also be applied to at least one of the first conductive layers 14 shown in FIG. 7, so that the first conductive layer 14 may have exposed pad 14 b. In this case, the pads of the first inspection group, the pads of the second inspection group, the pads of the third inspection group, and the pads of the fourth inspection group shown in FIG. 3 and FIG. 4 may include the pads formed of one of the first conductive layers 14, or the pads formed of two first conductive layers 14 shown in FIG. 7. In some embodiments, the inspection lines shown in FIG. 3 and FIG. 4 may include the inspection lines 14 a of one of the first conductive layers 14, or the inspection lines 14 a of two first conductive layers 14 shown in FIG. 7. The other portions of the manufacturing method of this embodiment may be the same as or similar to those of the above-mentioned embodiments, so the same portions may refer to the description of the above-mentioned embodiments and will not be repeated.

FIG. 8 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure. As shown in FIG. 8, in the manufacturing method of this embodiment, after the release layer 16 is formed, the first conductive layer 14 may be formed on the release layer 16, so that the release layer 16 is disposed between the first conductive layer 14 and the carrier substrate 12. For example, the first conductive layer 14 may be a seed layer used to assist the formation of the second conductive layer 221. In the embodiment of FIG. 8, the second conductive layer (for example, the second conductive layer 224) may also include a pad (for example, the pad 224 a) in the peripheral region 12 b, and the first conductive layer 14 may also include at least one pad 14 b disposed in the peripheral region 12 b, and the pad 14 b may be electrically connected to the inspection line 14 a. In this embodiment, the release layer 16 and the redistribution layer 20 may not be formed on the pad 14 b, so that the pad 14 b is exposed. Therefore, one of the input/output terminals 26 may provide the input signal to or receive the output signal from the pad 14 b during the inspection step. In some embodiments, the redistribution layer 20 may not be formed in the peripheral region 12 b, so that the second conductive layers may have no pad in the peripheral region 12 b. In some embodiments, the first conductive layer 14 of FIG. 8 may not have exposed pad 14 b. In some embodiments, the pads of the first inspection group, the pads of the second inspection group, the pads of the third inspection group, and the pads of the fourth inspection group shown in FIG. 3 and FIG. 4 may also include the pad 14 b formed of the first conductive layer 14 of FIG. 8. In some embodiments, the inspection lines shown in FIG. 3 and FIG. 4 may include the inspection lines 14 a of the first conductive layer 14 of FIG. 8. In some embodiments, the input/output terminals 26 for receiving the output signals may include a contact-type detector, such as a probe. In some embodiments, the input/output terminals 26 for receiving the output signals may include a noncontact-type detector, such as an electric field sensor. The other portions of the manufacturing method of this embodiment may be the same as or similar to those of the above-mentioned embodiments, so the same portions may refer to the description of the above-mentioned embodiments and will not be repeated.

FIG. 9 is a schematic diagram illustrating a manufacturing method of a package device according to some embodiments of the present disclosure. As shown in FIG. 9, the manufacturing method of this embodiment may further include forming a third conductive layer 34 on the release layer 16, and the third conductive layer 34 may be formed between the release layer 16 and the second conductive layer 221. The third conductive layer 34 may include silver, copper, aluminum, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium, indium, bismuth, alloys thereof, combinations thereof, or other metal materials with good conductivity, but not limited thereto. For example, the third conductive layer 34 may be a seed layer used to form the second conductive layer 221. In the embodiment of FIG. 9, the third conductive layer 34 may also include an inspection line 34 a for electrically connecting at least one of the pads of the second conductive layer in the device region 12 a to at least one of the pads of the second conductive layer in the peripheral region 12 b. Taking the second conductive layer 224 as an example, the pad 224 a of the second conductive layer 224 may be electrically connected to the pad 224 b of the second conductive layer 224 through the inspection line 34 a.

As shown in FIG. 9, in some embodiments, the third conductive layer 34 may further include a plurality of connection pads 34 c, and the first conductive layer 14 is electrically connected to the second conductive layers through the plurality of connection pads 34 c. Specifically, the connection pads 34 c may electrically connect the inspection lines 14 a of the first conductive layer 14 to the redistribution layer 20 through the contact structures 18 a and the contact structure 18 b. It should be noted that the inspection line 14 a of the first conductive layer 14 and the inspection line 34 a of the third conductive layer 34 may be electrically isolated from each other, so that the different pads (such as the pads 224 a) of the second conductive layers in the device region 12 a may be electrically connected to the different pads (for example, the pads 224 b) of the second conductive layers in the peripheral region 12 b through the inspection line 14 a of the first conductive layer 14 and the inspection line 34 a of the third conductive layer 34, respectively. Through the first conductive layer 14 and the third conductive layer 34, the manners of electrically connecting the pads in the device region 12 a to the pads in the peripheral region 12 b may be increased, thereby increasing the number of pad groups and the number of pads used for inspection in the peripheral region 12 b. In other words, compared with the embodiment of FIG. 2, the pads in the device region 12 a may be divided into more groups in this embodiment, thereby increasing the manners of inspecting circuits, or simultaneously inspecting more pad groups to improve inspection efficiency. In some embodiments, before the release layer 16 is formed, multiple first conductive layers 14 and at least one insulating layer 32 may be formed.

In some embodiments, the first conductive layer 14 shown in FIG. 5 or FIG. 6 may also be applied to the first conductive layer 14 and/or the third conductive layer 34 shown in FIG. 9, so that the first conductive layer 14 and/or the third conductive layer 34 may have exposed pad. In this case, the pads of the first inspection group, the pads of the second inspection group, the pads of the third inspection group, and the pads of the fourth inspection group shown in FIG. 3 and FIG. 4 may include the pads of the first conductive layer 14, the pads of the third conductive layer 34 of FIG. 9, or a combination thereof. In some embodiments, the inspection lines shown in FIG. 3 and FIG. 4 may include the inspection lines 14 a of the first conductive layer 14, the inspection line 34 a of the third conductive layer 34 of FIG. 9, or a combination thereof. The other portions of the manufacturing method of this embodiment may be the same as or similar to those of the above-mentioned embodiments, so the same portions may refer to the description of the above-mentioned embodiments and will not be repeated.

In summary, through the above-mentioned manufacturing methods of package devices, the inspection steps may be performed in real time on the second conductive layers formed in different steps, so that the components of the package devices are inspected out the defects in real time during the manufacturing processes without waiting for the inspection after the chips are bonded, or the components of the package devices may be repaired before the package devices are completed to reduce the manufacturing cost. In addition, through forming the additional first conductive layer and/or third conductive layer between the redistribution layer and the carrier substrate, it may help to divide the pads in the device region into more groups, thereby increasing the manners of inspecting circuits, or simultaneously inspecting more pad groups to improve the inspection efficiency.

Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the disclosure. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims. 

What is claimed is:
 1. A manufacturing method of a package device, comprising: providing a carrier substrate, at least one first conductive layer, and a release layer, wherein the carrier substrate has at least one device region and a peripheral region, and the at least one first conductive layer and the release layer are disposed on the carrier substrate; forming a second conductive layer on the release layer, wherein at least one of the at least one first conductive layer and the second conductive layer comprises at least one first pad, the at least one first pad is disposed in the peripheral region of the carrier substrate, the second conductive layer comprises at least one second pad, the at least one second pad is disposed in the at least one device region of the carrier substrate, and the at least one second pad is electrically connected to the at least one first pad through the at least one first conductive layer; and performing an inspection step to provide an input signal to one of the at least one first pad and the at least one second pad, and to receive an output signal from another of the at least one first pad and the at least one second pad.
 2. The manufacturing method of the package device according to claim 1, wherein the at least one first conductive layer is disposed between the release layer and the carrier substrate.
 3. The manufacturing method of the package device according to claim 2, wherein providing the at least one first conductive layer further comprises providing at least two first conductive layers and an insulating layer, and the insulating layer is disposed between the at least two first conductive layers.
 4. The manufacturing method of the package device according to claim 3, wherein a plurality of through holes are formed in the insulating layer, one of the at least two first conductive layers on the insulating layer comprises a connection pad extending into the plurality of through holes.
 5. The manufacturing method of the package device according to claim 2, further comprising forming a third conductive layer between the release layer and the second conductive layer.
 6. The manufacturing method of the package device according to claim 5, wherein the third conductive layer comprises an inspection line, and the at least one second pad is electrically connected to the at least one first pad through the inspection line.
 7. The manufacturing method of the package device according to claim 5, wherein the third conductive layer comprises a plurality of connection pads, and the at least one first conductive layer is electrically connected to the second conductive layer through the plurality of connection pads.
 8. The manufacturing method of the package device according to claim 2, further comprising after providing the release layer, forming at least one contact structure penetrating the release layer, wherein the at least one second pad is electrically connected to the at least one first conductive layer through the at least one contact structure.
 9. The manufacturing method of the package device according to claim 1, wherein the release layer is disposed between the at least one first conductive layer and the carrier substrate.
 10. The manufacturing method of the package device according to claim 1, wherein the at least one second pad comprises a plurality of second pads, the plurality of second pads are divided into a plurality of pad groups that are electrically isolated from each other, the at least one first pad comprises a plurality of first pads, and the plurality of first pads are electrically connected to the plurality of pad groups, respectively, through the at least one first conductive layer.
 11. The manufacturing method of the package device according to claim 10, further comprising forming a plurality of lines, wherein two of the plurality of lines corresponding to different two of the plurality of pad groups are electrically isolated from each other.
 12. The manufacturing method of the package device according to claim 10, wherein the at least one first conductive layer comprises a plurality of inspection lines, and one of the plurality of first pads is electrically connected to one of the plurality of pad groups through one of the plurality of inspection lines.
 13. The manufacturing method of the package device according to claim 10, wherein the inspection step comprises providing the input signal to one of the plurality of first pads, and receiving the output signal and another output signal from at least two of the plurality of second pads respectively.
 14. The manufacturing method of the package device according to claim 1, wherein the output signal is received by a contact-type or noncontact-type manner.
 15. The manufacturing method of the package device according to claim 1, further comprising forming another second conductive layer before forming the second conductive layer, wherein the another conductive layer comprises a plurality of conductive pillars.
 16. The manufacturing method of the package device according to claim 1, further comprising forming another second conductive layer after performing the inspection step.
 17. The manufacturing method of the package device according to claim 1, further comprising forming at least one line, wherein the at least one first conductive layer comprises at least one inspection line, the at least one line is electrically connected between the at least one second pad and the at least one inspection line.
 18. The manufacturing method of the package device according to claim 1, wherein the at least one first pad comprises a plurality of first pads, and the at least one second pad comprises a plurality of second pads, and wherein the inspection step comprises providing the input signal and another input signal to at least two of the plurality of first pads.
 19. The manufacturing method of the package device according to claim 18, wherein the input signal and the another input signal are a low-frequency signal and a high-frequency signal respectively.
 20. The manufacturing method of the package device according to claim 1, further comprising forming a dielectric layer on the release layer before forming the second conductive layer, and the dielectric layer has a plurality of openings. 